3DFlex: A flexible system for total visual inspection of bumped devices

Abstract

Most bumped packages (WL-CSPs, BGAs, etc) undergo the necessary 3D visual inspection in tray-scan machines or at the wafer level, or sometimes there is no 3D inspection, relying on process stability and correlation with 2D inspection alone. This means the device are further manipulated before they are placed into tape, and there is the risk of them being actually damaged. This risk is more important as bumps become smaller.