Totally self-checking (TSC) VLSI circuits using Scalable Error Detection Coding (SEDC) technique

Natarajan Somasundaram, Farhad Mehdipour, Jeong-A Lee, N. Ramadass, Y. V. R. Rao
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引用次数: 1

Abstract

Integrated circuits fabricated in deep sub-micron technology are vulnerable to intermittent or transient faults which are the predominant cause of system failures. With continued scaling, operating voltage levels have reduced and resultant decrease in noise margins, the possibility of transient faults is likely to increase. Also, during operation in adverse environments, transient faults occur upon exposure to ionizing radiations and neutron effects. These faults manifest themselves as unidirectional errors. The ability to operate in the intended manner even in the presence of faults is an important objective of all electronic systems. Totally Self-checking (TSC) circuits permit online detection of hardware faults. The Scalable Error Detection Coding (SEDC) technique used to design self-checking circuits with faster execution and lesser latency overhead for use in fault-tolerant VLSI circuits is presented. SEDC technique is formulated and architecture is designed in such a way that for any input binary data length, only area is scaled, with a constant latency of two logic gates and requires only a single clock cycle for generating SEDC code. It is shown that the proposed SEDC technique is found to be significantly efficient than the existing unidirectional error detection techniques in terms of speed, latency, area and achieving 100% error detection.
采用可扩展错误检测编码(SEDC)技术的完全自检(TSC) VLSI电路
采用深亚微米技术制造的集成电路容易受到间歇性或瞬态故障的影响,这是导致系统故障的主要原因。随着持续的缩放,工作电压水平降低,噪声范围随之降低,瞬态故障的可能性可能会增加。此外,在恶劣环境中运行时,暴露于电离辐射和中子效应会发生瞬态故障。这些错误表现为单向错误。即使在存在故障的情况下也能以预期的方式运行是所有电子系统的一个重要目标。完全自检(TSC)电路允许在线检测硬件故障。提出了可扩展错误检测编码(SEDC)技术,用于设计具有更快执行速度和更小延迟开销的自检电路,用于容错VLSI电路。SEDC技术的制定和体系结构的设计是这样的:对于任何输入二进制数据长度,只有面积被缩放,具有两个逻辑门的恒定延迟,并且只需要一个时钟周期来生成SEDC代码。结果表明,所提出的SEDC技术在速度、延迟、面积和100%的错误检测方面都明显优于现有的单向错误检测技术。
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