An Insight into the High Current ESD Behavior of Drain Extended NMOS (DENMOS) Devices in Nanometer Scale CMOS Technologies

A. Chatterjee, S. Pendharkar, Yen-Yi Lin, C. Duwury, K. Banerjee
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引用次数: 9

Abstract

Second breakdown phenomenon (It2) in drain extended NMOS (DENMOS) which is associated with complex triggering of the parasitic BJT is relatively less understood. We present experiments and models to understand the physics of snapback in DENMOS in nanometer scale technologies. Avalanche injection phenomenon at the drain contact has been analyzed for a 90 nm DENMOS transistor under high current stressing
纳米级CMOS技术中漏极扩展NMOS (DENMOS)器件的大电流ESD行为研究
在漏极扩展型NMOS (DENMOS)中,与寄生BJT的复杂触发相关的二次击穿现象(It2)相对较少被了解。我们提出了实验和模型来理解纳米尺度技术中DENMOS的回冲物理。分析了90 nm DENMOS晶体管在大电流应力作用下漏极接触处的雪崩注入现象
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