Thermal management and thermal resistance of high power LEDs

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) Pub Date : 2007-09-01 DOI:10.1109/THERMINIC.2007.4451776

T. Zahner

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引用次数: 24

Abstract

Summary form given only. The junction temperature of Light Emitting Diodes (LEDs) is a primary reliability parameter. Exceeding the maximum rated junction temperature could lead to accelerated light output degradation and sometimes even to catastrophic failures. Besides that junction temperature influences the desired LED properties in applications like light output efficiency, dominant wavelength and forward voltage. Therefore thermal management and proper thermal characterisation of high power LEDs is very important for a reliable product with good performance. By measuring the thermal resistance of a high power LED it has to take into account that the power applied to the device is converted into heat and light (-20-40% efficiency). This means that the thermal resistance of a LED can not be determined without knowing the energy flux emitted as light. Therefore in general the interpretation of a given thermal resistance of an optoelectronic device is not well defined. Establishing of a standard on how to do thermal resistance measurement for light emitting devices is necessary.

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大功率led的热管理和热阻

只提供摘要表格。发光二极管(led)的结温是一个重要的可靠性参数。超过最大额定结温可能导致加速光输出退化，有时甚至是灾难性的故障。此外，结温还会影响LED在光输出效率、主导波长和正向电压等方面的性能。因此，高功率led的热管理和适当的热特性对于一个可靠的、性能良好的产品是非常重要的。通过测量高功率LED的热阻，它必须考虑到施加到器件上的功率转换为热和光(-20-40%的效率)。这意味着，如果不知道以光的形式发射的能量通量，就不能确定LED的热阻。因此，一般来说，光电器件的给定热阻的解释不是很好地定义。有必要对发光器件的热阻测量制定标准。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)

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