Panel: When will the cost of dependability end innovation in computer design?

V. Bertacco
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引用次数: 1

Abstract

As silicon feature sizes approach atomic scales, device reliability is waning and the cost of dependability is on the rise. Post silicon devices, such as CNTs or TFETs, promise better performance but at the cost of even worse reliability. Will we reach the point where the cost of reliability for future silicon substrates is too expensive to justify their existence? Or will we discover new ways to contain the cost of dependability? If we do discover low-cost reliability mechanisms, how much time do we have before we must deploy them? If not, how much life does silicon have left?
专题讨论:可靠性的成本什么时候会终结计算机设计的创新?
随着硅特征尺寸接近原子尺度,器件可靠性正在下降,可靠性成本正在上升。后硅器件,如碳纳米管或tfet,承诺更好的性能,但代价是更差的可靠性。我们是否会达到未来硅衬底可靠性成本过高而无法证明其存在的地步?或者我们会发现新的方法来控制可靠性的成本吗?如果我们确实发现了低成本的可靠性机制,在我们必须部署它们之前,我们还有多少时间?如果不是,硅还剩下多少生命?
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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