Integration of a low-k organic polymer material (k=2.3) for reducing both resistance and capacitance

Abstract

We demonstrated an integration of a non-progen organic polymer (k=2.3) developed by Sumitomo Bakelite Co. Ltd. H2/He plasma damage recovery process which was developed for organic materials achieved 5% capacitance reduction with keeping enough TDDB reliability. The mechanism was presumed by chemical analysis. Moreover, the TDDB lifetime was not degraded even without a barrier metal, indicating this polymer could enable resistance reduction for its Cu diffusion barrier performance. This polymer would reduce both resistance and capacitance.