Heat dissipation capability of package with integrated processor and 3D-stacked memory

Abstract

The thermal performance of 2.5D package with integrated processor and 2 memory stacks has been investigated, and 4 types of thermal lids without increasing the package footprint has been designed and evaluated. The heat dissipation capabilities of different structures were first analyzed under natural convection condition, and then forced air cooling condition was considered in portable device scenario. The effect of stiffener on the heat dissipation and thermal crosstalk has been analyzed. Under natural convection, providing heating power to both processor and memory, a total power around 3W can be dissipated. With forced air cooling in limited space, the initial package can dissipate around 6.5W heating power. By using the designed thermal lid, the dissipated heating power can be increased by almost one time. The results and conclusions obtained will aid the thermal design of 2.5D package.