Nonlinear Thermal and Mechanical Analysis in the Vibration of a Printed Wiring Board

Abstract

Nonlinear laminate theory is applied and extended for the printed wiring board dynamic analysis. Equations of motion for the isotropic laminates are derived for vibration response analysis of the simply supported printed wiring board under mechanical and thermal loads. Temperature variation in spatial domain is taken into consideration. The effect of the temperature variation on the response character is analyzed and demonstrated by means of numerical results. Modal analysis is made to predict the vibration behavior in terms of deflection and stresses. Lamina stresses are used for failure prediction.