D. Abessolo-Bidzo, R. Derikx, Paul Cappon, S. Zhao
{"title":"A Study of HBM and CDM Layout Simulations Tools","authors":"D. Abessolo-Bidzo, R. Derikx, Paul Cappon, S. Zhao","doi":"10.23919/EOS/ESD.2018.8509764","DOIUrl":null,"url":null,"abstract":"The use of EDA ESD checking tools has grown considerably in the past few years in the semiconductor industry. This paper gives an overview of four different HBM and CDM layout simulation tools. For the first time, a full CDM analysis combining predictive CDM SPICE and Layout simulations are presented.","PeriodicalId":328499,"journal":{"name":"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/EOS/ESD.2018.8509764","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The use of EDA ESD checking tools has grown considerably in the past few years in the semiconductor industry. This paper gives an overview of four different HBM and CDM layout simulation tools. For the first time, a full CDM analysis combining predictive CDM SPICE and Layout simulations are presented.