Power Microtransformer on Silicon Embedded into PCB

Abstract

In this work, a feasibility concept for packaging microtransformer devices with integrated magnetic core fabricated on silicon wafers is presented. For packaging, the embedding technology into PCBs is applied. The microtransformer chips with size of 2.5 mm x 2.0 mm are embedded into PCB package with a size of 3.3 mm x 3.0 mm. The profile height of 0.45 mm is achieved for microtransformer devices which were removed from silicon substrate. Electrical test of packaged devices show the reduction of parasitic effects and improvement of electrical performances.