Selection of operation mode on SOI/MOSFETs for high-resistivity load static memory cell

Y. Inoue, Y. Yamaguchi, T. Yamaguchi, J. Takahashi, T. Iwamatsu, T. Wada, Y. Nishimura, T. Nishimura, N. Tsubouchi
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引用次数: 2

Abstract

SOI/MOSFETs are widely known to have some advantages such as reduction of parasitic capacitance, improvement of subthreshold characteristics and increased drive current, compared with bulk-Si/MOSFETs. Moreover, this structure provides the reduction in the substrate-bias effect because the back-gate bias (Si substrate) is applied to the channel region through thick buried oxide. In the present paper, we propose the best choice of operation mode of SOI/MOSFETs in a high-resistivity load SRAM cell to improve the stability in the memory cell and to obtain sufficient static noise margin providing non-destructive reading of cell data at low supply voltage.<>
高电阻率负载静态存储电池SOI/ mosfet工作模式的选择
众所周知,与体硅/ mosfet相比,SOI/ mosfet具有降低寄生电容、改善亚阈值特性和增加驱动电流等优点。此外,这种结构减少了衬底偏置效应,因为反向偏置(Si衬底)通过厚埋氧化物施加到沟道区域。在本文中,我们提出了在高电阻率负载SRAM单元中SOI/ mosfet工作模式的最佳选择,以提高存储单元的稳定性,并获得足够的静态噪声裕度,从而在低电源电压下无损地读取单元数据
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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