Microchip cooling module based on FC72 slot jet arrays without cross-flow

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI:10.1109/STHERM.2006.1625206

M. Fabbri, A. Wetter, B. Mayer, T. Brunschwiler, B. Michel, H. Rothuizen, R. Linderman, U. Kloter

{"title":"Microchip cooling module based on FC72 slot jet arrays without cross-flow","authors":"M. Fabbri, A. Wetter, B. Mayer, T. Brunschwiler, B. Michel, H. Rothuizen, R. Linderman, U. Kloter","doi":"10.1109/STHERM.2006.1625206","DOIUrl":null,"url":null,"abstract":"In view of the rapid increase of microchip power densities, thermal management has become considerably more challenging. This work presents the first results of an effort aimed at developing a liquid-based cooling module capable of handling high heat fluxes. Four modules 20 times 20 times 2 mm3 in size, containing as many as 120 planar (\"slot\") jets and a drainage channel system that prevented any cross-flow effect, were tested using FC72 as test fluid. The jet hydraulic diameters were between 173 and 310 mum, with larger drainage channels, 701 to 955 mum in diameter, located between the inlet jets. A custom-made heater resembling an actual microchip was manufactured from silicon and equipped with temperature sensors. The effects of the flow rate, the inlet liquid temperature, the gap between impinged surface and nozzle plate, and different module geometries are discussed. A maximum of 92 W/cm2 was removed at a junction temperature of 85 degC using a coolant flow of 1.46 l/min and an inlet temperature of 20 degC","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2006.1625206","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 5

Abstract

In view of the rapid increase of microchip power densities, thermal management has become considerably more challenging. This work presents the first results of an effort aimed at developing a liquid-based cooling module capable of handling high heat fluxes. Four modules 20 times 20 times 2 mm3 in size, containing as many as 120 planar ("slot") jets and a drainage channel system that prevented any cross-flow effect, were tested using FC72 as test fluid. The jet hydraulic diameters were between 173 and 310 mum, with larger drainage channels, 701 to 955 mum in diameter, located between the inlet jets. A custom-made heater resembling an actual microchip was manufactured from silicon and equipped with temperature sensors. The effects of the flow rate, the inlet liquid temperature, the gap between impinged surface and nozzle plate, and different module geometries are discussed. A maximum of 92 W/cm2 was removed at a junction temperature of 85 degC using a coolant flow of 1.46 l/min and an inlet temperature of 20 degC

查看原文本刊更多论文

基于FC72无交叉流槽射流阵列的微芯片散热模块

鉴于微芯片功率密度的快速增长，热管理变得相当具有挑战性。这项工作提出了旨在开发能够处理高热流的基于液体的冷却模块的第一批成果。四个模块的尺寸为20 × 20 × 2 mm3，包含多达120个平面(“槽”)射流和一个排水通道系统，以防止任何交叉流动效应，使用FC72作为测试流体进行测试。射流水力直径在173 ~ 310 μ m之间，在进口射流之间有较大的排水通道，直径在701 ~ 955 μ m之间。一个类似于实际微芯片的定制加热器由硅制成，并配备了温度传感器。讨论了流量、进口液温、冲击面与喷嘴板间隙以及不同模块几何形状等因素的影响。在结温85℃下，使用1.46 l/min的冷却液流量和20℃的入口温度，最大可去除92 W/cm2

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium

自引率

0.00%

发文量