Power cycling test and failure mode analysis of high-power module

Abstract

Power module with high power density and high heat dissipation structure has been developed because of increasing requirement for high-power electric products. Power cycling test (PCT) was often adopted to assess to reliability of power module while the cyclic load was applied in power chip. This study investigates the electro-thermo-mechanical behavior of high-power module by using numerical analysis, and assesses its reliability through PCT. First, the current density, corresponding temperature distribution and mechanical behavior of high-power module are predicted by using electro-thermal coupling and thermo-mechanical analysis. In order to satisfy automotive electronics application, the cycling period of minute-level was chosen and applied in high-power module to conduct the reliability test.