Optoelectronic chips and multichip modules

Abstract

A novel concept of optoelectronic chips and multichip modules (MCMs) is presented. This concept is based on direct integration of single-mode optoelectronics with VLSI/ULSI CMOS technology. This concept allows direct communication between silicon chips and modules without implementing GaAs electronics. External electrooptic (EO) modulators and silicon photodetectors are used as transceivers while optical power is provided by continuous wave (CW) laser diodes (LDs). In analogy with multilayer MCM electrical interconnects, multilayer optical interconnects are provided in the form of polymeric light-distributing interconnect-active (LIDIA) substrates. As a result, the integrated waveguide technology is monolithically integrated through LIDIA intrachip, chip-to-chip, and module-to-module substrates with silicon MCM circuitry.<>