Networks-In-Package: Performances management and design methodology

Abstract

Nowadays large scale MPSoC designs embedding multiple processors, memories and specialized IPs require high integration densities which can not be met at an acceptable cost within the standard single-chip technology. The systems-in-package (SiP) approach has been proposed then as an alternative which enables such integration requirements. Even though analysis of systems-in-package design techniques shows large similarities with standard techniques for multi-chip-modules (MCM), there is a huge methodological lack for communication-centric MPSoCs. In this paper we motivate the need for new design methodologies which addresses the various problems of the emerging NiP (networks-in- package) paradigm with a special focus on performances considerations. We also propose a complete NoC architecture (MS-NoC) and a design flow aimed at helping designers to build NiP architectures.