Design for Reliability

T. Turner
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引用次数: 122

Abstract

The ITRS lists several areas where reliability technology needs development. This includes test methods for new materials and processes. However, perhaps the greatest change in reliability assurance is the requirement to place more of the responsibility for reliability assurance into the hands of circuit designers. This stems from the general compromising of reliability to obtain higher performance. Semiconductor processes can no longer be though of as reliable for all designs that pass a few simple design rules. Reliable designs can now only be produced with a significant investment in reliability simulations, cell library testing and advanced test structure development. Designers must look at effects due to parametric distributions, thermal limits, stresses introduced by packages and neutron and alpha particle radiation. The shift of this responsibility to circuit designers will change the traditional foundry/fabless relationship and will likely increase the demands for detailed failure analysis in the future
可靠性设计
ITRS列出了可靠性技术需要发展的几个领域。这包括新材料和新工艺的测试方法。然而,也许可靠性保证的最大变化是要求将可靠性保证的更多责任交给电路设计人员。这源于为了获得更高的性能而对可靠性的普遍妥协。对于通过一些简单设计规则的所有设计,半导体工艺不再被认为是可靠的。现在,只有在可靠性模拟、单元库测试和先进测试结构开发方面进行大量投资,才能产生可靠的设计。设计人员必须考虑由于参数分布、热极限、包装以及中子和α粒子辐射引入的应力而产生的影响。将这种责任转移到电路设计师身上,将改变传统的代工厂/无晶圆厂关系,并可能增加未来对详细故障分析的需求
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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