Room temperature bonding of Polymethylglutarimide for layer transfer method

Abstract

Room temperature bonding of Polymethylglutarimide was performed for a damage-free layer transfer method. The PMGI layer was bonded to support Si wafer by using the Surface activated bonding method using nano-adhesion layers. Using SAB, bonded area covering around 90% of the wafer surface, with a room temperature bond strength of ~1 J/m2 is achieved. Micro voids at bond interface are never observed using scanning electron microscope. For debonding process, PMGI dissolve in N-methylpyrrolidone based solvent. Extremely small amount PMGI residues are detected by using atomic force microscope surface profile.