Scaling of 3D interconnect technology incorporating metal-metal bonds to pitches of 10 microns and below for infrared focal plane array applications

Abstract

We will review the status of the implementation of high density area array 3D integration technology relying on low temperature metal-metal bonds in functional infrared imaging systems, and will discuss scaling of the technology for compatibility with readout integrated circuits for focal plane arrays with 10 micron and smaller pixels. Future research needs in this rapidly growing application area will be identified.