Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials

Abstract

As a concept to achieve high throughput low cost flip chip on board (FCOB) assembly, a process development activity and reliability assessment is underway, implementing next generation flip chip processing based on large area underfill printing/dispensing, integrated chip placement and underfill flow, and simultaneous solder interconnect reflow and underfill cure. Reported in this work is the assembly of a series of test vehicles to evaluate the reliability of no-flow underfill materials. The reliability performance of four underfill materials is evaluated using six test vehicles. Accelerated reliability tests performed on the test vehicles included liquid/liquid and air/air thermal cycling, autoclave, and J-STD-020 Level 3 preconditioning. No-flow underfill materials tested in this work have demonstrated the ability to survive in excess of 1000 cycles of liquid/liquid thermal shock, survive more than 100 hours of autoclave, and pass J-STD-020 Level 3 preconditioning.