Reliability design on wearable device for initial osteoarthritis (OA) on knee joints

H. Hsu, Pin-Chieh Wang, Jia-Jung Wang, S. Fu
{"title":"Reliability design on wearable device for initial osteoarthritis (OA) on knee joints","authors":"H. Hsu, Pin-Chieh Wang, Jia-Jung Wang, S. Fu","doi":"10.1109/ICEP.2016.7486801","DOIUrl":null,"url":null,"abstract":"More than 750,000 females and 500,000 males in Taiwan will be diagnosed as osteoarthritis (OA) patient in 2018. Also, two thirds of orthopedics outpatients are found to be associated with OA. Therefore, it becomes necessary and essential to detect the severity of OA knee joints as early as possible and to release/reduce the knee pain induced by OA. In recent years, the wearable technology has become the fastest growing electronic technology because of size miniaturization, low power consumption, intelligence, and convenience features. There are two features of wearables, i.e. the space is limited and the substrate used should be flexible and stretchable. In this paper, an innovated wireless wearable apparatus has been developed to detect OA symptom. A chip embedded flexible PDMS substrate with ultrafine conduct lines and laser-drilled vias is required for this innovated wearable devices. The packaging technology developed in this work is to vertically/horizontally assemble ultra-thin heterogeneous ICs, sensors, passive components, interposer or flexible substrate into a single package. In addition, reliability test and evaluation are conducted to evaluate one-time maximum bending test and duration bending test. In this paper, “develop a packaging technique for smart wireless wearable devices for OA detection” and “develop test standards for smart wireless wearable apparatus” will be presented.","PeriodicalId":343912,"journal":{"name":"2016 International Conference on Electronics Packaging (ICEP)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEP.2016.7486801","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

More than 750,000 females and 500,000 males in Taiwan will be diagnosed as osteoarthritis (OA) patient in 2018. Also, two thirds of orthopedics outpatients are found to be associated with OA. Therefore, it becomes necessary and essential to detect the severity of OA knee joints as early as possible and to release/reduce the knee pain induced by OA. In recent years, the wearable technology has become the fastest growing electronic technology because of size miniaturization, low power consumption, intelligence, and convenience features. There are two features of wearables, i.e. the space is limited and the substrate used should be flexible and stretchable. In this paper, an innovated wireless wearable apparatus has been developed to detect OA symptom. A chip embedded flexible PDMS substrate with ultrafine conduct lines and laser-drilled vias is required for this innovated wearable devices. The packaging technology developed in this work is to vertically/horizontally assemble ultra-thin heterogeneous ICs, sensors, passive components, interposer or flexible substrate into a single package. In addition, reliability test and evaluation are conducted to evaluate one-time maximum bending test and duration bending test. In this paper, “develop a packaging technique for smart wireless wearable devices for OA detection” and “develop test standards for smart wireless wearable apparatus” will be presented.
膝关节初发性骨关节炎可穿戴设备的可靠性设计
2018年,台湾将有超过75万女性和50万男性被诊断为骨关节炎(OA)患者。此外,三分之二的骨科门诊患者被发现与OA有关。因此,尽早发现OA膝关节的严重程度,缓解/减轻OA引起的膝关节疼痛是必要的和必要的。近年来,可穿戴技术以其尺寸小型化、低功耗、智能化、便捷化等特点成为发展最快的电子技术。可穿戴设备有两个特点,即空间是有限的,所使用的基板应该是灵活的和可拉伸的。本文开发了一种创新的无线可穿戴设备,用于检测OA症状。这种创新的可穿戴设备需要具有超细导线和激光钻孔过孔的柔性PDMS衬底芯片。在这项工作中开发的封装技术是垂直/水平组装超薄异质集成电路、传感器、无源元件、中间体或柔性基板到单个封装中。另外,对一次性最大弯曲试验和持续弯曲试验进行了可靠性试验和评价。本文将提出“开发用于OA检测的智能无线可穿戴设备的封装技术”和“开发智能无线可穿戴设备的测试标准”。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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