Next generation computing systems with heterogeneous packaging integration

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947441

J. Knickerbocker

引用次数: 0

Abstract

IBM Research and Micro-System Technology and Solutions Team are enabling next generation computing systems with heterogeneous packaging integration that support both large size / high performance systems and also support miniaturized / low power mobile wireless systems / sensors.

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具有异构封装集成的下一代计算系统

IBM研究院和微系统技术和解决方案团队正在通过异构封装集成实现下一代计算系统，这些系统既支持大尺寸/高性能系统，也支持小型化/低功耗移动无线系统/传感器。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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