Novel TAB inner lead bonding technology eliminating bump formation process

1992 Proceedings 42nd Electronic Components & Technology Conference Pub Date : 1992-05-18 DOI:10.1109/ECTC.1992.204310

Y. Otsuka, H. Kaneko, J. Sasaki, M. Itoh, K. Takekawa, A. Yoshigai, M. Urushima

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引用次数: 2

Abstract

A novel tape automated bonding (TAB) inner lead bonding (ILB) technology, wherein an individual inner lead can be directly bonded with an individual bonding pad for ICs without using any gold bumps, was developed. The proposed ILB technology makes it possible to attain high density packaging as well as highly reliable connections. In addition, packaging costs can be drastically reduced, by eliminating the bump formation process. The key to successful direct connections, practical bond strength without causing any damage in the pad structure, is producing uniform vertical stress distribution on the bonding area during the bonding process. A newly developed bonding process and a specifically designed bond tool make it possible to produce uniform vertical stress distribution. A bondability study, involving pull tests on the bonded tape leads and high-temperature storage tests, was carried out. The results showed the viability of the proposed ILB technology as a reliable connection process. Basic bond tests for high density packaging were also attempted. It was ascertained that this technology has a great potential for fine pitch connections.<>

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新颖的TAB内引线粘合技术，消除了凹凸形成过程

开发了一种新型的磁带自动键合(TAB)内引线键合(ILB)技术，其中单个内引线可以直接与集成电路的单个键合垫键合，而无需使用任何金凸起。提出的ILB技术使实现高密度封装和高可靠连接成为可能。此外，通过消除凹凸形成过程，可以大大降低包装成本。成功实现直接连接的关键是在粘合过程中在粘合区域产生均匀的垂直应力分布，从而实现实际的粘合强度，而不会对焊盘结构造成任何破坏。新开发的粘接工艺和专门设计的粘接工具可以产生均匀的垂直应力分布。进行了粘合性研究，包括对粘合带引线的拉力试验和高温储存试验。结果表明，所提出的ILB技术是一种可靠的连接工艺。高密度包装的基本粘结试验也进行了尝试。结果表明，该技术具有实现细间距连接的巨大潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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1992 Proceedings 42nd Electronic Components & Technology Conference

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