Hot-carrier-induced degradation in ultra-thin, fully-depleted, deep-submicron nMOS and pMOS SOI transistors

T. Tsuchiya, T. Ohno, Y. Kado, J. Kai
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引用次数: 4

Abstract

The hot-carrier-injected oxide region is systematically investigated for fully depleted surface-channel (SC) nMOS and SC- and buried-channel pMOSFETs fabricated on an ultra-thin (50 nm)-film SIMOX wafer. NMOSFET degradation is shown to be caused mainly by hot-carriers injected into the drain side of the front oxide and pMOSFET degradation by hot-electrons injected into the drain side of both the back oxide and the front oxide. It is shown experimentally for the first-time that these fully depleted devices with effective channel lengths of 0.1-0.2 /spl mu/m have fairly high hot-carrier immunity, even for single-drain structures.<>
超薄、完全耗尽、深亚微米nMOS和pMOS SOI晶体管的热载流子诱导退化
系统地研究了在超薄(50 nm)薄膜SIMOX晶圆上制备的完全耗尽表面沟道(SC) nMOS和SC沟道和埋沟道pmosfet的热载流子注入氧化区。NMOSFET的降解主要是由注入到前氧化物漏极侧的热载子引起的,而pMOSFET的降解主要是由注入到后氧化物和前氧化物漏极侧的热电子引起的。实验首次表明,这些有效通道长度为0.1-0.2 /spl mu/m的完全耗尽器件具有相当高的热载流子抗扰度,即使对于单漏结构也是如此。
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