Reliability, test, and I/sub DDQ/ measurements

C. Hawkins, A. Keshavarzi, J. Soden
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引用次数: 10

Abstract

I/sub DDQ/ measurements are strongly identified with CMOS IC testing, however I/sub DDQ/ also has long term links to IC reliability. This paper overviews the association of reliability and I/sub DDQ/ testing. Three reliability topics are discussed: fundamental failure mechanisms, the relation of I/sub DDQ/ to burn-in, and the use of test data to predict reliability performance.
可靠性、测试和I/sub DDQ/测量
I/sub DDQ/测量与CMOS IC测试密切相关,但I/sub DDQ/也与IC可靠性有长期联系。本文综述了可靠性与I/sub DDQ/测试的关系。讨论了三个可靠性问题:基本失效机制,I/sub DDQ/与磨损的关系,以及使用测试数据预测可靠性性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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