B. Nagl, B. Czerny, M. Lederer, G. Khatibi, M. Thoben, J. Nicolics
{"title":"Experimental investigation of transient electrical, thermal and mechanical behavior of IGBT inverter modules during operation","authors":"B. Nagl, B. Czerny, M. Lederer, G. Khatibi, M. Thoben, J. Nicolics","doi":"10.1109/ISPSD.2013.6694467","DOIUrl":null,"url":null,"abstract":"This study comprises the electrical analysis of an experimental investigation on thermo-mechanical vibration measurements on an IGBT inverter structure under operating conditions and shows a new way how to experience reliability relevant phenomena. In order to perform transient temperature measurements with IR thermography and optical vibration measurements one sub-system of the inverter module was extracted and operated at equivalent conditions. Necessary circuit modifications including parasitic impedances and their most important influences are discussed. The investigation revealed a strong dependence of the thermo-mechanical bonding wire vibrations on the inverter output frequency. At 1 Hz an amplitude of more than 4 μm was measured at the loop peak of a short bonding wire.","PeriodicalId":175520,"journal":{"name":"2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2013.6694467","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
This study comprises the electrical analysis of an experimental investigation on thermo-mechanical vibration measurements on an IGBT inverter structure under operating conditions and shows a new way how to experience reliability relevant phenomena. In order to perform transient temperature measurements with IR thermography and optical vibration measurements one sub-system of the inverter module was extracted and operated at equivalent conditions. Necessary circuit modifications including parasitic impedances and their most important influences are discussed. The investigation revealed a strong dependence of the thermo-mechanical bonding wire vibrations on the inverter output frequency. At 1 Hz an amplitude of more than 4 μm was measured at the loop peak of a short bonding wire.