Linearity Behavior of a Pocket Doped p-type Ground Plane FDSOI: Impact of Back Biasing

R. Shaik, K. P. Pradhan
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Abstract

In this work; a FDSOI MOSFET with p type ground plane (pGP) to suppress the depletion region under BOX, pockets in source/drain sides to mitigate the impact ionization has been used for investigating linearity figure-of-merits (FOMs) under the influence of back-bias ($\mathrm{V}_{B}$) for superior tuning of device performance. Linearity investigations performed at transistor level can exponentially improve the reliability of the IC. This can reduce the need for complex circuitry and area significantly without affecting the overall system reliability. The current work focuses on analysing analog FOMs for the proposed device structure under the influence $\mathrm{V}_{B}$ engineering using a well calibrated industry standard TCAD tool Silvaco ATLAS. The analysis is carried out quantitatively by extracting HD2, HD3, VIP2, VIP3 and IIP3. These merits are extracted from a single tone DC transfer characteristic output of the device considering transconductance (gm) as fundamental and its higher order coefficients ($\mathrm{g}_{m2},\ \mathrm{g}_{m3},\ \ldots$) as harmonics. The results from the analysis suggest an optimized linearity at the zero-crossover point $(\mathrm{V}_{dc-bias})$ in the $\mathrm{g}_{m3}$ plot.
口袋掺杂p型地平面FDSOI的线性特性:后偏置的影响
在这项工作中;FDSOI MOSFET具有p型接平面(pGP)来抑制BOX下的耗尽区,源/漏侧口袋以减轻冲击电离,已用于研究反向偏置($\ mathm {V}_{B}$)影响下的线性性能图(FOMs),以实现器件性能的卓越调谐。在晶体管级进行的线性调查可以成倍地提高IC的可靠性。这可以显著减少复杂电路和面积的需求,而不会影响整个系统的可靠性。目前的工作重点是使用经过校准的工业标准TCAD工具Silvaco ATLAS,分析在$\math {V}_{B}$工程影响下提出的器件结构的模拟FOMs。通过提取HD2、HD3、VIP2、VIP3和IIP3进行定量分析。这些优点是从器件的单音直流转移特性输出中提取的,考虑跨导(gm)为基波,其高阶系数($\ mathm {g}_{m2},\ \ mathm {g}_{m3},\ \ldots$)为谐波。分析结果表明,在$\mathrm{g}_{m3}$图中,零交叉点$(\mathrm{V}_{dc-bias})$处线性优化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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