Analysis of plasma damage on phase change memory cells

F. Pellizzer, A. Spandre, S. Alba, A. Pirovano
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引用次数: 1

Abstract

Phase change memories based on chalcogenide materials are being studied as an alternative for nonvolatile information storage, because they can become attractive for technology nodes beyond 65 nm due to their intrinsic scalability In this paper we propose a first analysis of plasma damage of phase memory cells, starting from the basic electrical characteristics of storage elements and then including the effects of different selecting devices. Taking into account the architecture of phase change arrays, we will evaluate typical etching conditions and try to understand any possible impact on cell parameters and performances. Finally we will show some electrical results on real devices, integrated in a standard CMOS process in 0.18 /spl mu/m technology.
相变记忆细胞的等离子损伤分析
基于硫族化合物材料的相变存储器正被研究作为非易失性信息存储的替代方案,因为它们具有固有的可扩展性,可以在65 nm以上的技术节点上变得有吸引力。本文首先从存储元件的基本电特性开始,然后包括不同选择器件的影响,对相记忆细胞的等离子损伤进行了分析。考虑到相变阵列的结构,我们将评估典型的蚀刻条件,并试图了解任何可能对电池参数和性能的影响。最后,我们将展示实际器件上的一些电气结果,这些器件集成在0.18 /spl mu/m技术的标准CMOS工艺中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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