C. Tabery, M. Craig, G. Burbach, B. Wagner, S. McGowan, P. Etter, S. Roling, C. Haidinyak, E. Ehrichs
{"title":"Process window and device variations evaluation using array-based characterization circuits","authors":"C. Tabery, M. Craig, G. Burbach, B. Wagner, S. McGowan, P. Etter, S. Roling, C. Haidinyak, E. Ehrichs","doi":"10.1109/ISQED.2006.107","DOIUrl":null,"url":null,"abstract":"Highly customizable and scaleable scribe-based circuits have been demonstrated as effective tools for gathering process window response curves and variations data not easily obtained through standard electrical test structure approaches or inline characterization. This work demonstrates the feasibility of using these types of circuits in design rule definition, mask validation, lithography margining, and OPC qualification and refinement. Finally, given their small form factors, they are easily adopted in high-volume manufacturing environments as process monitoring tools","PeriodicalId":138839,"journal":{"name":"7th International Symposium on Quality Electronic Design (ISQED'06)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"7th International Symposium on Quality Electronic Design (ISQED'06)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2006.107","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14
Abstract
Highly customizable and scaleable scribe-based circuits have been demonstrated as effective tools for gathering process window response curves and variations data not easily obtained through standard electrical test structure approaches or inline characterization. This work demonstrates the feasibility of using these types of circuits in design rule definition, mask validation, lithography margining, and OPC qualification and refinement. Finally, given their small form factors, they are easily adopted in high-volume manufacturing environments as process monitoring tools