New material technology for high density interconnections

Abstract

A new technology is discussed that allows for the efficient interconnection of Surface Mounted Components (SMC) to high density substrates. This technology is based on the selective through metalization of porous, expanded polytetrafluoroethylene (ePTFE) membranes using a photoimaging process. The selective metalized membrane can be coated or filled with resins or adhesives to yield an Anisotropic Z-Axis Interface.