EMI modeling and correlation in a highly integrated package design

Abstract

Electromagnetic emission must be properly addressed in complex multi-chip packages (MCM) due to highly miniaturized form-factor requirements. Such modules induce electric and magnetic fields due to high frequency current paths, and if not contained within a susceptible limit, can cause other electronic components to malfunction or compliance failure. Testing for electromagnetic interference (EMI) in the lab after the system is built could be too late. This paper presents an approach to understand the possible EMI sources in a highly integrated complex package system. An EMI simulation methodology has been developed and correlation to near-field measurements is used to establish the accuracy of the simulation. A full wave 3D solver was used to perform the EMI simulation in frequency domain. The emissions were also measured using near-field probes within a shielded chamber. Good correlation was achieved between the measurements and simulations, suggesting benefits of the proposed methodology.