A planar, nearly ideal, SiC device edge termination

D. Alok, B. J. Baliga
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引用次数: 7

Abstract

In this paper, a simple edge termination is described which can be used to achieve nearly ideal parallel plane breakdown voltage in silicon carbide devices. This novel termination, involves implantation of a neutral species on the edges of devices to form a high resistivity amorphous layer. With this termination, formed using argon implantation, the breakdown voltage of Schottky barrier diodes was measured to be very close to the ideal parallel plane breakdown voltage.
一种近乎理想的平面SiC器件边缘端接
本文介绍了一种简单的边缘端接方法,可以在碳化硅器件中获得接近理想的平行平面击穿电压。这种新型终端涉及到在器件边缘植入中性物质以形成高电阻率非晶层。利用氩注入形成的这种终端,测量到肖特基势垒二极管的击穿电压非常接近理想的平行平面击穿电压。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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