Electrical transmission characteristics of differential TSV structures in 3D TSV packaging

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Pub Date : 2015-12-01 DOI:10.1109/EPTC.2015.7412269

Meng Zhen, Yan Yue-peng, Wang Chen, Zhang Xingcheng, Liu Mou

{"title":"Electrical transmission characteristics of differential TSV structures in 3D TSV packaging","authors":"Meng Zhen, Yan Yue-peng, Wang Chen, Zhang Xingcheng, Liu Mou","doi":"10.1109/EPTC.2015.7412269","DOIUrl":null,"url":null,"abstract":"The electrical characteristics of Through Silicon Via (TSV) have been frequently studied recently, but most studies focused on the single-ended TSV structure. Specially, study about the differential TSV structure is rather limited. In this study, three-dimensional electromagnetic simulation software HFSS was used to analyze the transmission characteristics of the differential signal of the differential TSV structure. Firstly, the differential TSV structure was modeled to analyze the impact on the transmission characteristics of differential signal by the main structural parameters achieved in the mainstream process. Our results indicate that the forward transmission gain increases when the TSV diameter and the thickness of the SiO2 oxide isolation layer increase. However, the forward transmission gain decreases when the TSV height increases. Secondly, the differential TSV structure in the TSV arrangement was modeled. The influence of the pitch of the differential TSV pair on the transmission performance of the differential signal is not a one-way process. Finally, the conical differential TSV structure was modeled to study the influence of non-ideal cylinder shape on the transmission performance of the differential signal. Our results indicate that the forward transmission gain increases when the upper diameter increases and the bottom diameter keeps unchanged.","PeriodicalId":418705,"journal":{"name":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","volume":"79 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2015.7412269","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

Abstract

The electrical characteristics of Through Silicon Via (TSV) have been frequently studied recently, but most studies focused on the single-ended TSV structure. Specially, study about the differential TSV structure is rather limited. In this study, three-dimensional electromagnetic simulation software HFSS was used to analyze the transmission characteristics of the differential signal of the differential TSV structure. Firstly, the differential TSV structure was modeled to analyze the impact on the transmission characteristics of differential signal by the main structural parameters achieved in the mainstream process. Our results indicate that the forward transmission gain increases when the TSV diameter and the thickness of the SiO2 oxide isolation layer increase. However, the forward transmission gain decreases when the TSV height increases. Secondly, the differential TSV structure in the TSV arrangement was modeled. The influence of the pitch of the differential TSV pair on the transmission performance of the differential signal is not a one-way process. Finally, the conical differential TSV structure was modeled to study the influence of non-ideal cylinder shape on the transmission performance of the differential signal. Our results indicate that the forward transmission gain increases when the upper diameter increases and the bottom diameter keeps unchanged.

查看原文本刊更多论文

三维TSV封装中差分TSV结构的电传输特性

近年来，人们对硅通孔(TSV)的电学特性进行了大量的研究，但大多数研究都集中在单端TSV结构上。特别是对差分TSV结构的研究相当有限。本研究采用三维电磁仿真软件HFSS对差分TSV结构的差分信号传输特性进行了分析。首先，对差分TSV结构进行建模，分析主流过程中获得的主要结构参数对差分信号传输特性的影响;结果表明，随着TSV直径和SiO2氧化物隔离层厚度的增加，正向传输增益增大。而前向传输增益随着TSV高度的增加而减小。其次，对TSV布置中的差分TSV结构进行了建模。差分TSV对的间距对差分信号传输性能的影响不是单向的。最后，对锥形差分TSV结构进行建模，研究非理想圆柱形状对差分信号传输性能的影响。结果表明，当上直径增大而下直径不变时，前向传输增益增大。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

自引率

0.00%

发文量