Advanced fault isolation techniques for 3D packaging

Abstract

3D packaging has become a popular technology along with the tendency of functionality and portability for electronic devices. Conventional fault isolation techniques face a great challenge for 3D packaging devices. 3D X-Ray laminography technique can capture three-dimensional information about the internal structure of an object. Magnetic current imaging technique is a non-destructive failure isolation technique at package levels. This paper introduces these two kinds of useful fault isolation techniques for 3D packaging. And case studies demonstrated the effectiveness of the advanced fault isolation techniques for 3D packaging.