Yang Han, C. Dang, Evert Visker, J. Visker, Aurelie Humbertv, Lan Peng
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引用次数: 0
Abstract
This study investigates the effect of low-temperature temporary bonding on thickness uniformity, back grinding, and glue removal after debonding. 140 °C proves to be compatible with backside processes and effectively facilitates glue removal for microfluidic devices used in lifescience applications.