Macro and micro-texture study for understanding whisker growth in Sn coatings

Piyush Jagtap, Praveen Kumar
{"title":"Macro and micro-texture study for understanding whisker growth in Sn coatings","authors":"Piyush Jagtap, Praveen Kumar","doi":"10.1109/EPTC.2016.7861464","DOIUrl":null,"url":null,"abstract":"The current work is aimed at analyzing the effects of crystallographic texture, both macro and microtexture, on whisker growth. The macro-texture of the Sn coatings deposited on brass substrate was systematically studied by varying the process parameters used for electro-deposition. The combination of process parameters, such as deposition temperature and current density, and the resulting macro-texture most prone to whisker growth were identified by monitoring the whisker growth in Sn coatings. The electron back-scatter diffraction (EBSD) technique was then used to identify the grains where whiskers actually grow. Both macro- and micro-texture of Sn coatings revealed that coatings with pre-dominant low Miller index grain orientations, such as (100), were highly susceptible for whisker growth. Whisker propensity decreased as the texture transitioned from low to high Miller index grain orientation. The microtexture mapping of the Sn coatings using EBSD technique confirmed that whisker grows from low Miller index grains with (100) or near (100) orientations, surrounded by grains of similar orientation followed by grains with high index plane grains, such as (211), (210) or (321). This particular double ring configuration along with local stress field can be used to predict the locations for whisker growth.","PeriodicalId":136525,"journal":{"name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","volume":"97 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2016.7861464","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The current work is aimed at analyzing the effects of crystallographic texture, both macro and microtexture, on whisker growth. The macro-texture of the Sn coatings deposited on brass substrate was systematically studied by varying the process parameters used for electro-deposition. The combination of process parameters, such as deposition temperature and current density, and the resulting macro-texture most prone to whisker growth were identified by monitoring the whisker growth in Sn coatings. The electron back-scatter diffraction (EBSD) technique was then used to identify the grains where whiskers actually grow. Both macro- and micro-texture of Sn coatings revealed that coatings with pre-dominant low Miller index grain orientations, such as (100), were highly susceptible for whisker growth. Whisker propensity decreased as the texture transitioned from low to high Miller index grain orientation. The microtexture mapping of the Sn coatings using EBSD technique confirmed that whisker grows from low Miller index grains with (100) or near (100) orientations, surrounded by grains of similar orientation followed by grains with high index plane grains, such as (211), (210) or (321). This particular double ring configuration along with local stress field can be used to predict the locations for whisker growth.
通过宏观和微观织构研究来了解锡镀层中晶须的生长
本研究旨在分析宏观和微观晶构对晶须生长的影响。通过改变电沉积工艺参数,系统地研究了镀在黄铜基体上的锡镀层的宏观织构。通过对锡镀层中晶须生长的监测,确定了沉积温度和电流密度等工艺参数的组合,以及由此产生的最容易产生晶须生长的宏观织构。电子反向散射衍射(EBSD)技术随后被用于识别晶须实际生长的颗粒。镀层的宏观和微观织构表明,低米勒指数取向(100)的镀层对晶须生长非常敏感。晶须倾向随着织构由低米勒指数取向向高米勒指数取向转变而降低。利用EBSD技术对Sn涂层进行显微织构映射,证实了晶须从(100)或近(100)取向的低米勒指数晶粒生长,周围是取向相似的晶粒,其次是(211)、(210)或(321)等高米勒指数平面晶粒。这种特殊的双环结构和局部应力场可以用来预测晶须生长的位置。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信