Measurement challenges for on-wafer RF-SOC test

Wai Lau
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引用次数: 19

Abstract

With the wireless industry pushing towards higher levels of integration, with more system-in-a-package (SIP) and multi-chip module (MCM) technology, known-good-die testing of RF-SOC devices has emerged as the next test challenge. These devices have higher packaging costs compared to the traditional single die integrated circuits (ICs), and potential lower yields, since multiple dice are used. As a result, the cost to perform comprehensive on-wafer testing is outweighed by the cost to scrap the devices during the final package test. In addition, some IC manufacturers are selling bare die to be used in the SIP or MCM of another manufacturer. On-wafer test is then required to ensure that good product is shipped. This paper will use a Bluetooth radio modem chip as an example to discuss the measurement challenges and considerations for known-good die testing of a RF-SOC device. With this example, the difficulty of testing RF functionality on-wafer will be compounded by the need to source and measure RF and digital signals simultaneously, creating signal integrity issues. This paper will explore the challenges of laying out the printed circuit board for the device under test (DUT), including setup of the wafer probe card and assembly. Factors taken into account when selecting a probe station, RF wafer probe card, and ATE test system will then be discussed. This paper will conclude with a discussion of on-wafer calibration, including challenges and solutions. Real results from the Bluetooth radio modem chip example will be used to further the discussion.
圆片上RF-SOC测试的测量挑战
随着无线行业向更高的集成度迈进,越来越多的系统级封装(SIP)和多芯片模块(MCM)技术的出现,RF-SOC设备的已知优良芯片测试已成为下一个测试挑战。与传统的单芯片集成电路(ic)相比,这些器件的封装成本更高,而且由于使用了多个芯片,因此产量可能更低。因此,在最终封装测试期间报废器件的成本超过了进行全面晶圆上测试的成本。此外,一些IC制造商正在销售裸模,以用于另一家制造商的SIP或MCM。然后需要晶圆上测试,以确保出货良好的产品。本文将以蓝牙无线电调制解调器芯片为例,讨论RF-SOC器件的已知好芯片测试的测量挑战和注意事项。在这个例子中,由于需要同时采集和测量RF和数字信号,从而产生信号完整性问题,因此在晶圆上测试RF功能的难度将会增加。本文将探讨为被测设备(DUT)布置印刷电路板的挑战,包括晶圆探头卡的设置和组装。然后将讨论在选择探测站、射频晶圆探测卡和ATE测试系统时需要考虑的因素。本文最后将讨论晶圆上校准,包括挑战和解决方案。本文将利用蓝牙无线电调制解调器芯片实例的实际结果进一步进行讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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