Interface state degradation of metal/ultra-thin oxide/semiconductor structures under electron injections at high field

K. Kassmi, R. Maimouni
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引用次数: 2

Abstract

In this paper we analyze the interface states of metal/ultra thin oxide/semiconductor structures and their degradation under electron injection from the metal or the semiconductor, by the Fowler-Nordheim effect, at high electric field (>10 MV/cm). The metal used is chromium and the oxide layer thickness is in the range of 60 /spl Aring/-130 /spl Aring/. Before injection the energy distribution of the interface states in the semiconductor gap presents a peak of energy of 0.25 eV above the semiconductor valence band edge. The peak density (Nssmax) decreases with the oxide thickness. After injection the degradation of the Nssmax density depends on the oxide thickness, and increases with injected charge independently of the injected field and the polarization mode (V<0, V>0) of the structure for the high injected charge (Qinj>2.10/sup -1/ c/cm/sup 2/). The injection influence on the interface state density (Nssmid) at mid gap is not important. The Nssmid density is lower than 10/sup 10/ eV/sup -1/ cm/sup -2/ for all the injection charges (V<0, V>0). Also, we showed that the sensitivity to the degradation by electron injection decreases with the oxide thickness. In comparing with the literature results, we deduced a lower interface state density for our structures, and a satisfactory sensitivity to the degradation to high injecting fields.
高场电子注入下金属/超薄氧化物/半导体结构界面态的退化
本文利用Fowler-Nordheim效应分析了金属/超薄氧化物/半导体结构在高电场(>10 MV/cm)下的界面态及其在金属或半导体电子注入下的降解。所用金属为铬,氧化层厚度范围为60 /spl /-130 /spl /。注入前,半导体间隙中界面态的能量分布在半导体价带边缘上方出现0.25 eV的能量峰值。峰值密度(Nssmax)随氧化物厚度的增加而减小。注入后,Nssmax密度的下降与氧化物厚度有关,且随注入量的增加而增加,而高注入量(Qinj>2.10/sup -1/ c/cm/sup 2/)的结构极化模式(V0)与注入场无关。注入对中隙处界面态密度(Nssmid)的影响不大。所有注入药药(V0)的Nssmid密度均小于10/sup 10/ eV/sup -1/ cm/sup -2/。此外,我们还发现电子注入降解的敏感性随氧化物厚度的增加而降低。通过与文献结果的比较,我们推断出我们的结构具有较低的界面态密度,并且对高注入场的降解具有令人满意的敏感性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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