WLCSP back-end considerations

Abstract

The rapid adoption of WLCSPs in a wide range of form factor sensitive packaging applications is underway. To date, the pace of this technology deployment has been slowed by the absence of a robust infrastructure to enable its availability in high volumes. This paper will highlight some of the issues associated with the current WLCSP supply base and efforts that are underway to put in place full turn-key services to support this packaging technology.