S. Wisher, P. Shao, A. Norouzpour-Shirazi, Y. Yang, E. Ng, I. Flader, Y. Chen, D. Heinz, T. Kenny, F. Ayazi
{"title":"A high-frequency epitaxially encapsulated single-drive quad-mass tri-axial resonant tuning fork gyroscope","authors":"S. Wisher, P. Shao, A. Norouzpour-Shirazi, Y. Yang, E. Ng, I. Flader, Y. Chen, D. Heinz, T. Kenny, F. Ayazi","doi":"10.1109/MEMSYS.2016.7421784","DOIUrl":null,"url":null,"abstract":"This paper introduces a `high-frequency' resonant tri-axial tuning fork gyroscope (TFG) with a single-drive mode of operation. The quad-mass device is implemented on a 2×2 mm2 vacuum-packaged die fabricated using the epi-seal process, making this one of the smallest wafer-level packaged 3-axis gyros. In contrast to conventional resonant TFGs, the resonant frequencies are designed to be relatively high (~138 kHz) permitting high bandwidth for mode-matched operation and enhancing resistance to shock and vibration. The results show sensitivity to all three axes with mode-matched operation for the Z-axis and mode-split for the X- and Y-axes.","PeriodicalId":157312,"journal":{"name":"2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-02-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2016.7421784","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
This paper introduces a `high-frequency' resonant tri-axial tuning fork gyroscope (TFG) with a single-drive mode of operation. The quad-mass device is implemented on a 2×2 mm2 vacuum-packaged die fabricated using the epi-seal process, making this one of the smallest wafer-level packaged 3-axis gyros. In contrast to conventional resonant TFGs, the resonant frequencies are designed to be relatively high (~138 kHz) permitting high bandwidth for mode-matched operation and enhancing resistance to shock and vibration. The results show sensitivity to all three axes with mode-matched operation for the Z-axis and mode-split for the X- and Y-axes.