No pumping at 450°C with electrodeposited copper TSV

Abstract

1.The additive A shows no pumping with electrodeposited copper TSV. 2. The resistivity of electrodeposited copper TSV after 450°C annealing for the wiring is only 1.09 of conventional electrodeposited copper. 3.The 34% TEC reduction has been realized at 230°C for solder reflow temperature for PCB. The 34% reduction has been obtained after the second annealing after 200°C, 60min with the additive B. 4.The resistivity of PCB copper after annealing is only 1.32 of conventional electrodeposited copper.