Dynamic self-clamping at short-circuit turn-off of high-voltage IGBTs

T. Basler, Riteshkumar Bhojani, J. Lutz, R. Jakob
{"title":"Dynamic self-clamping at short-circuit turn-off of high-voltage IGBTs","authors":"T. Basler, Riteshkumar Bhojani, J. Lutz, R. Jakob","doi":"10.1109/ISPSD.2013.6694440","DOIUrl":null,"url":null,"abstract":"Measurements show that the IGBT is able to clamp the collector-emitter voltage to a certain value at short-circuit turn-off despite a very low gate turn-off resistor in combination with a high parasitic inductance is applied. The IGBT itself reduces the turn-off diC/dt by avalanche injection. However, device destructions during fast turn-off were observed which cannot be linked with an overvoltage failure mode. Measurements and semiconductor simulations of high-voltage IGBTs explain the self-clamping mechanism in detail. Possible failures which can be connected with filamentation processes are described. Options for improving the IGBT robustness during short-circuit turn-off are discussed.","PeriodicalId":175520,"journal":{"name":"2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"23","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2013.6694440","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 23

Abstract

Measurements show that the IGBT is able to clamp the collector-emitter voltage to a certain value at short-circuit turn-off despite a very low gate turn-off resistor in combination with a high parasitic inductance is applied. The IGBT itself reduces the turn-off diC/dt by avalanche injection. However, device destructions during fast turn-off were observed which cannot be linked with an overvoltage failure mode. Measurements and semiconductor simulations of high-voltage IGBTs explain the self-clamping mechanism in detail. Possible failures which can be connected with filamentation processes are described. Options for improving the IGBT robustness during short-circuit turn-off are discussed.
高压igbt短路关断时的动态自箝位
测量表明,IGBT能够在短路关断时将集电极-发射极电压箝位到一定值,尽管应用了非常低的栅极关断电阻和高寄生电感。IGBT本身通过雪崩注入降低了关断diC/dt。然而,在快速关断期间观察到的器件破坏与过压失效模式无关。高压igbt的测量和半导体模拟详细解释了自箝位机制。描述了可能与成丝过程有关的故障。讨论了在短路关断期间提高IGBT鲁棒性的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信