Development of FCBGA substrate with low Dk/Df material based on automotive reliability conditions

Abstract

With the recent emergence of AI and 5G, semiconductor packaging requires higher level of integration and ultra-fine technology. In the server and data center fields, trends are increasing number of I/O and package size. Advancements in autonomous vehicles and car infotainment are requiring higher level of packaging reliability. Areas requiring high-speed operation, fast response, and low delay such as server and autonomous are required to employ packaging materials with low dielectric constant (Dk) and low dielectric loss (Df). In this paper, study result for development of FCBGA substrate using low Df ABF material (GL102) is provided. The FCBGA substrate structure used in the experiment is 14 layer (6-2-6) and the dimension of the substrate is $47.5^{\ \ast}\ 47.5$ mm square.