Erik E. Lorenz, Joshua Gehre, L. Jäckel, J. Schuster
{"title":"Film Growth from Particle Raytracing: A Simulation Method for Vapor Deposition Processes with Changing Surface Topographies","authors":"Erik E. Lorenz, Joshua Gehre, L. Jäckel, J. Schuster","doi":"10.1109/IITC/MAM57687.2023.10154705","DOIUrl":null,"url":null,"abstract":"We present a numerical method for the simulation of vapor deposition processes in complex 3D microstructures, which couples a raytracing-based particle Monte Carlo transport model with Level Set methods for thin film growth. Through the incorporation of different particle-surface interaction models, our method models a wide range of deposition techniques, including Physical Vapor Deposition (PVD), Chemical Vapor Deposition and Atomic Layer Deposition (ALD). We demonstrate our method on trench filling with a two-step copper resputter PVD process and a model ALD process.","PeriodicalId":241835,"journal":{"name":"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC/MAM57687.2023.10154705","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We present a numerical method for the simulation of vapor deposition processes in complex 3D microstructures, which couples a raytracing-based particle Monte Carlo transport model with Level Set methods for thin film growth. Through the incorporation of different particle-surface interaction models, our method models a wide range of deposition techniques, including Physical Vapor Deposition (PVD), Chemical Vapor Deposition and Atomic Layer Deposition (ALD). We demonstrate our method on trench filling with a two-step copper resputter PVD process and a model ALD process.