Challenges in extending single-ended graphics memory data rates

S. Mukherjee, D. Oh, A. Vaidyanath, D. Dressler, A. Sendhil
{"title":"Challenges in extending single-ended graphics memory data rates","authors":"S. Mukherjee, D. Oh, A. Vaidyanath, D. Dressler, A. Sendhil","doi":"10.1109/EPEPS.2012.6457838","DOIUrl":null,"url":null,"abstract":"While the need for higher graphics memory bandwidth continues to grow, it is evident that owing to the multitude of challenges in single ended signaling, pushing data rates beyond 6 Gbps is exceedingly difficult. To isolate, quantify and combat the most important factors that limit the performance of modern high speed single ended systems, a high speed GDDR5 memory system (link width: ×32) has been designed using a Rambus prototype test-chip (TSMC 40 nm process node) and a leading single ended signaling graphics GDDR5 DRAM. Critical challenges faced in scaling the data rates up to 8 Gbps are presented and the varying impact of these challenges on the system margin is shown for increasing speeds. An example of a chip-to-chip system between two prototype test chips, that mitigates these performance limiting determinants, is shown to operate robustly at data rates beyond 8 Gbps. The ingredients of this system are likely techniques for the future graphics memories.","PeriodicalId":188377,"journal":{"name":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2012.6457838","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

While the need for higher graphics memory bandwidth continues to grow, it is evident that owing to the multitude of challenges in single ended signaling, pushing data rates beyond 6 Gbps is exceedingly difficult. To isolate, quantify and combat the most important factors that limit the performance of modern high speed single ended systems, a high speed GDDR5 memory system (link width: ×32) has been designed using a Rambus prototype test-chip (TSMC 40 nm process node) and a leading single ended signaling graphics GDDR5 DRAM. Critical challenges faced in scaling the data rates up to 8 Gbps are presented and the varying impact of these challenges on the system margin is shown for increasing speeds. An example of a chip-to-chip system between two prototype test chips, that mitigates these performance limiting determinants, is shown to operate robustly at data rates beyond 8 Gbps. The ingredients of this system are likely techniques for the future graphics memories.
扩展单端图形存储器数据速率的挑战
虽然对更高图形内存带宽的需求持续增长,但很明显,由于单端信号的众多挑战,将数据速率提高到6gbps以上是非常困难的。为了隔离、量化和对抗限制现代高速单端系统性能的最重要因素,采用Rambus原型测试芯片(台积电40纳米工艺节点)和领先的单端信号图形GDDR5 DRAM设计了高速GDDR5存储系统(链路宽度:×32)。提出了将数据速率扩展到8 Gbps所面临的关键挑战,并显示了随着速度的增加,这些挑战对系统边际的不同影响。两个原型测试芯片之间的芯片对芯片系统的一个例子,减轻了这些性能限制因素,显示出在超过8 Gbps的数据速率下可靠地运行。这个系统的成分很可能是未来图形存储器的技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信