The application of RSM in optimization of the curing profile for electronic packaging polymers

Abstract

Process-induced warpage is a major concern for the electronic packages. In this paper, a combined methodology of numerical simulation and optimization algorithm is developed to predict the warpage caused by the curing process of the thermosetting polymer and the subsequent cooling down phase and minimize the warpage. A plane strain FEM model is established to simulate the thermal-mechanical characters of flip chip package. Anand mode and Maxwell mode are adopted to describe the time and temperature dependent material properties for eutectic solder joints and epoxy underfill, respectively. Based on the simulation result, response surface method (RSM) and constrained variable metric method(CVM) are employed to find optimal curing profile for underfill in flip chip packaging. The simulation results show that package warpage can be effectively reduced by choosing optimal curing profile.