Subthreshold MOSFET conduction model and optimal scaling for deep-submicron fully depleted SOI CMOS

P. Yeh, J. Fossum
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引用次数: 8

Abstract

In this paper we present results of a comprehensive study of the subthreshold characteristics of deep-submicron fully depleted SOI MOSFETs, and suggest optimal CMOS scaling rules based on PISCES simulations and two-dimensional analytic modeling for circuit simulation. Measurements reveal that the subthreshold swing S, which is nearly ideal at 60 mV for long-channel fully depleted devices, tends to increase drastically as L is scaled to deep-submicron values. Our previous study showed that the front-surface current contributes to the increased S via gate bias-dependent source/drain charge sharing, which reduces the effective threshold voltage. A more recent study shows that current throughout the SOI film body, including the back surface, tends to overwhelm the front-surface current in the subthreshold region, rendering the drain current less dependent on the front-gate bias and hence increasing S even more.<>
深亚微米完全耗尽SOI CMOS的亚阈值MOSFET传导模型和最佳缩放
在本文中,我们介绍了深亚微米完全耗尽SOI mosfet的亚阈值特性的综合研究结果,并提出了基于双鱼座模拟和电路仿真二维解析建模的最佳CMOS缩放规则。测量结果表明,对于长通道完全耗尽的器件,在60 mV时的亚阈值摆幅S几乎是理想的,当L缩放到深亚微米值时,S趋于急剧增加。我们之前的研究表明,通过栅极偏置相关的源极/漏极电荷共享,前表面电流有助于增加S,从而降低有效阈值电压。最近的一项研究表明,整个SOI膜体(包括后表面)的电流倾向于在亚阈值区域压倒前表面电流,从而使漏极电流更少地依赖于前门偏置,从而进一步增加S。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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