High-performance Silicon-On-Glass VDMOS Transistor for RF-Power Applications

N. Nenadovic, W. Cuoco, M.P. van de Heijden, L. Nanver, J. Slotboom, S. Theeuwen, H. Jos
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引用次数: 8

Abstract

A complete analysis of DC and RF performance of a novel SOI vertical DMOS transistor on glass and a conventional LDMOS transistor for RF power applications is presented. The analysis is based on MEDICI device simulations and the ”Smoothie” database model for FET devices. An SOI VDMOST on glass with a breakdown of 115V, a specific on-resistance RONSP of 3mΩcm 2 ,a n fTmax of 7.4 GHz at VDS=26V and a saturation current of 1.25·10 �4 A/µ ma t VDS=10V is demonstrated. A device with 1mm long gate has PAE of 43% and power gain of 18.5 dB with 1dB compression point at POUT=26dBm. Since this SOI VDMOS device shows better linearity and higher power gain compared to conventional LDMOST, it would be the device of choice for RF power applications. Moreover, silicon-on-glass technology offers integration with high quality passives and the possibility to electroplate copper heat sinks only a few microns away from the active device area. Both features are very important for development of integrated power amplifiers.
用于射频功率应用的高性能玻璃上硅VDMOS晶体管
对一种新型SOI垂直玻璃DMOS晶体管和一种传统的用于射频功率应用的LDMOS晶体管的直流和射频性能进行了全面分析。该分析基于MEDICI器件仿真和FET器件的“Smoothie”数据库模型。设计了一种SOI VDMOST,击穿115V,比导通电阻RONSP为3mΩcm 2, VDS=26V时的n fTmax为7.4 GHz, VDS=10V时的饱和电流为1.25·10·4 a /µma。在POUT=26dBm的1dB压缩点下,1mm长栅极器件的PAE为43%,功率增益为18.5 dB。由于该SOI VDMOS器件与传统LDMOST相比具有更好的线性度和更高的功率增益,因此它将成为射频功率应用的首选器件。此外,玻璃上硅技术提供了与高质量无源器件的集成,并且可以在距离有源器件区域仅几微米的地方电镀铜散热器。这两个特性对于集成功率放大器的发展是非常重要的。
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