TCAD modeling of accumulated damage during time-dependent mixed-mode stress

U. Raghunathan, P. Chakraborty, Brian R. Wier, J. Cressler, H. Yasuda, P. Menz
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引用次数: 7

Abstract

We study the accumulated degradation of SiGe HBTs under time-dependent mixed-mode stress using a new physics-based TCAD degradation model that simulates hot carrier generation and propagation to oxide interfaces, resulting in trap formation. We calibrate the avalanche generation and also do a multipoint calibration of damage on the I-V output plane to accurately predict the accumulated stress damage for a single device over multiple bias points. Looking at the region of the output plane dominated by trap formation, we show that accumulation of traps can be path-independent as long as trap availability is not limiting. We demonstrate this with good correlation between simulation and measurement.
时变混合模态应力累积损伤的TCAD建模
我们使用一种新的基于物理的TCAD降解模型研究了SiGe HBTs在时间依赖混合模式应力下的累积降解,该模型模拟了热载流子的产生和传播到氧化物界面,从而导致陷阱的形成。我们对雪崩产生进行校准,并对I-V输出平面上的损伤进行多点校准,以准确预测单个器件在多个偏置点上的累积应力损伤。观察由圈闭形成主导的输出平面区域,我们表明,只要圈闭的可用性不受限制,圈闭的积累可以是路径无关的。我们通过仿真和测量之间的良好相关性证明了这一点。
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