I/sub DDQ/ testing for submicron CMOS IC technology qualification

J. Soden
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引用次数: 12

Abstract

Sandia is manufacturing high reliability CMOS ICs with a 0.5 micron CMP technology, as part of the progression to 0.35 micron and smaller scale technologies. To qualify this technology for delivery of high reliability ICs to customers for military, space, and commercial applications, a qualification program has been implemented that includes extensive loop testing. Two vehicles are being used for this qualification, a 256 K bit SRAM and a Microcontroller Core (MCC). Both of these ICs present unique loop testing challenges. This paper describes the methods used to successfully implement I/sub DDQ/ testing for these two types of ICs.
I/sub DDQ/测试用于亚微米CMOS IC技术鉴定
Sandia正在生产采用0.5微米CMP技术的高可靠性CMOS ic,这是向0.35微米及更小规模技术发展的一部分。为了使该技术能够为军事、太空和商业应用的客户提供高可靠性集成电路,已经实施了一个包括广泛环路测试的认证计划。两个车辆被用于这个资格,一个256 K位SRAM和一个微控制器核心(MCC)。这两种ic都提出了独特的环路测试挑战。本文介绍了对这两种类型的集成电路成功实现I/sub DDQ/测试的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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