Packaging and AC powering of LED array

W. Feng, Yongzhi He, F. Shi
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引用次数: 5

Abstract

High power LEDs for lighting application can be implemented with dies. Multiple LEDs are usually connected in series to sustain high power supply voltage like AC 110V due to low LED forward voltage. AC-DC converter is often required for LED arrays working under an AC power supply. But the AC-DC converter brings power consumption overhead and degrades the overall system efficiency as much as 15%. In this work, a high power ceramic COB (Chip On Board) LED array packaging technology capable of working under AC 110V is developed. A total of 40 LEDs are used in the ceramic COB LEDs array to allow it work directly under AC 110V power supply. A special powering method is designed and dedicated to the COB LED array. The special powering method ensures both high light output and high LEDs array reliability especially under supply voltage variations. The measured COB LEDs current vs. AC supply voltage variation is shown in Fig.1 An extremely high driving efficiency (>98%) at the max power and a high power factor are achieved due to the elimination of the AC-DC converter. The electrical efficiency over LEDs forward current is plotted in Fig.2. The structure and top view of COB LED packaging is shown in Fig.3 and Fig.4. The COB package dimension is 68mm by 28mm. With 150mA LEDs forward current, the measured total power is 20W. The max LEDs forward current for this design is 700mA and the max power is 95W. The cross section of the PCB design is shown in Fig.5. Since AC-DC converter reliability is becoming the bottleneck of the high power LED lighting system, the presented ceramic COB LEDs array package with the special powering circuit reliability is enhanced due to the elimination of AC-DC converter. The system reliability is performed and shown in Fig.6. There is no performance degradation of both the ceramic COB LED and control circuit for 1000 hours. Long term reliability test of the system is still under testing and will be presented.
LED阵列封装及交流供电
用于照明应用的大功率led可以用芯片实现。由于LED正向电压低,通常采用多个LED串联,以维持交流110V等高电源电压。在交流电源下工作的LED阵列通常需要交直流转换器。但是,交流-直流转换器带来了电力消耗开销,并降低了整个系统效率高达15%。本文研究了一种可在交流110V下工作的高功率陶瓷COB (Chip On Board) LED阵列封装技术。在陶瓷COB led阵列中总共使用了40个led,使其能够直接在交流110V电源下工作。针对COB LED阵列,设计了一种特殊的供电方式。特殊的供电方式保证了高光输出和高led阵列的可靠性,特别是在电源电压变化的情况下。测量的COB led电流与交流电源电压的变化如图1所示。在最大功率下,由于消除了AC- dc转换器,实现了极高的驱动效率(>98%)和高功率因数。led正向电流的电效率如图2所示。COB LED封装结构及俯视图如图3和图4所示。COB封装尺寸为68mm × 28mm。在150mA led正向电流下,测量到的总功率为20W。本设计的最大led正向电流为700mA,最大功率为95W。PCB设计截面如图5所示。由于交直流变换器的可靠性已成为大功率LED照明系统的瓶颈,本文提出的陶瓷COB LED阵列封装由于消除了交直流变换器,其特殊的供电电路可靠性得到了提高。对系统进行可靠性计算,如图6所示。陶瓷COB LED和控制电路在1000小时内都没有性能下降。该系统的长期可靠性测试仍在测试中,并将提交。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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